The classification of Gold bonding wire used to be by mainly loop hight (high,middle and low), but it is now being requested by different device application. Tanaka has many products line-up for wide variety of customer's requirement and will continue further engineering development for next era.

Characteristics：

1.Steady bump shape
2.Small deviation of ball neck height after bumping
3.Higher bond reliability on Al pad surface

Usage：

Mostly used for SAW filter in the mobile phone and MR head of compact hard disk for laptop computer.