Aluminum and Aluminum alloy Bonding Wire


Al-1%Si Bonding Wire

Characteristics:

1.Stable mechanical property.
2.Good corrosion resistance under PCT(TABN).
3.Higher bond reliability on Al pad surface.

Usage:

In the various type of IC chip using for satellite to toys.


Al Bonding Wire for Power Devices

Characteristics:

1.Good corrosion resistance under PCT(TABN).
2.Excellent bondability.
3.Higher bond reliability on Al pad surface.

Usage:

Used for variety types of IC chip such as for automobile and household electrical appliance.


Products Guide Al

Al Bonding Wire for Power Devices

Characteristics:

1.Excellent corrosion resistance (Equal to TANW wire).
2.Corresponds to a multi size.

Size

Width 0.5mm~2.5mm

Thickness 0.05mm~0.3mm
3.Satisfactory surface smoothness.

Usage:

Al Bonding Ribbon for Power Devices(SOP,IGBT,・・・).


Products Guide Al-ribbon

 

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