Characteristics：

1.Lower Cost & Excellent Electrical Conductivity.
2.Better than Au wire in diffusion speed to Al pad.
3.Various wire type available satisfying engineering requirements.

 

Comparison of Gold & Copper

Physical Properties	Au	Cu
Resistivity：[μΩ・cm]	2.3	1.7
Thermal conductivity：[W/m・K]	320	398
Young‘s modulus：[GPa]	80	135

Cu bonding wire that has excellent properties as electric material.

Stable wire bonding performance by the preeminent quality control system and over 30 years manufacturing experiences.

Wires from a softness series to a hardness series are presented. It is possible to use general-purpose IC packages, not to mention Discrete device.