Characteristics：

1.Organic insulation coating.
2.Able to bond with standard wire bonding machines.

Advantages：

1.X-wire enables greater design flexibility.
2.X-wire enables wire diameter reduction, simplified long looping and high density
bonding layouts.
3.X-wire improves failure ratio at bonding process and molding process.
4.X-wire contributes to the cost savings through utilizing standardized reasonable packaging materials and processes.
5.X-wire helps to shorten lead time of experimental work thanks to its wide range of packaging materials application.