We explain different way of boinding technologies related to bonding wire here at Bonding-lab.

As a series of gold bonding wire manufacturing process, the annealing process and the winding process are explained here as Vol. 2. You will find our explanation on mechanical properties which are the most popular physical properties of bonding wire with focusing on tensile test carried out at the annealing process.

• 1. Tensile Test Property & Type of wire　2. Tensilon tester and heat treatment condition
• 3. Method of Tensilon testing　4. S-S Diagram explanation
  
• 5. We will explain up to here !

We would like to explain process of manufacturing bonding wire in the "Process of manufacturing of gold bonding wire Volume 1" through material processing starting with a unit of bonding wire which is used in production.The rest of the process of manufcturing will be explained in next lecture of Volume 2.

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  • 1. A unit of gold bonding wire-1
  • 2. A unit of gold bonding wire-2
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    3. Elasticity and plasticity
  • 4. Melting and Rolling Process
    
  • 5. Drawing Process

In this first lecture for bonding cycle, we will focus on bonding movement,can be devided approximately 4 sections. It will be explained using some animation while giving you an idea how the wire will change its shape and how it bonds.

• 1.What is bonding wire?
• 2.Ball Bonding
• 3.Loop
• 4.Switch & Tail Bonding